JPS6144456Y2 - - Google Patents
Info
- Publication number
- JPS6144456Y2 JPS6144456Y2 JP1402680U JP1402680U JPS6144456Y2 JP S6144456 Y2 JPS6144456 Y2 JP S6144456Y2 JP 1402680 U JP1402680 U JP 1402680U JP 1402680 U JP1402680 U JP 1402680U JP S6144456 Y2 JPS6144456 Y2 JP S6144456Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- reflector
- emitting element
- emitting display
- display surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 27
- 238000000149 argon plasma sintering Methods 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 18
- 238000007789 sealing Methods 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001207 Noryl Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1402680U JPS6144456Y2 (en]) | 1980-02-08 | 1980-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1402680U JPS6144456Y2 (en]) | 1980-02-08 | 1980-02-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56117562U JPS56117562U (en]) | 1981-09-08 |
| JPS6144456Y2 true JPS6144456Y2 (en]) | 1986-12-15 |
Family
ID=29610527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1402680U Expired JPS6144456Y2 (en]) | 1980-02-08 | 1980-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144456Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2743380B2 (ja) * | 1988-05-02 | 1998-04-22 | 松下電器産業株式会社 | 光学的パターン検出装置及びその製造方法 |
| JP4789350B2 (ja) * | 2001-06-11 | 2011-10-12 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
-
1980
- 1980-02-08 JP JP1402680U patent/JPS6144456Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56117562U (en]) | 1981-09-08 |
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